9/18/2015© 2014 88 Equipment

Equipment Engineering and Process Consulting

© 2014 88 Equipment 9/18/2015 2CONFIDENTIAL

Member Biographies

Peter J. Nowosad - President 20+ yrs. experience in project and customer support management WW

Broad semiconductor and equipment background

Engineering design for high-tech chemical/gas distribution systems

Knowledgeable in Diffusion, CVD, ALD, PVD, and Etch

Based and living in Taiwan since 2000

Todd O. Curtis - V.P. and Chief Technical Officer 40 yrs. experience in III-V and Silicon: CVD/ALD processing and integration R&D with IBM, Intel, TI, Motorola, SEMATECH, SELETE Japan, TSMC, ST… Semi-Materials R&D Apps. Lab Mngr: equip, metro, staff, training, facilities… Over 25 articles: CVD & ALD, silicon and III-V materials, device integration Technology consultant to the 22nm node, selective deposition patent

Dr. Len Mei - Key Advisor Intn’l Business and Technology Professor at the University of Campinas, Brazil and visiting Research Associate Professor at Stanford University Electronics Lab 30+ years experience including Fab Director and EVP of Operations /

Business Dev for major Semi companies such as ProMOS, Fairchild, etc

20+ patents in semiconductor technology and Published Author of

"Practices of Wafer Fab Operations“.

Michel D. Ouaknine - EU Operations & Technology

© 2014 88 Equipment 9/18/2015 3CONFIDENTIAL

Peter J. NowosadCompanies-Positions-Sites Supported

BA from Michigan Tech 1994

Silicon Systems / Texas Instruments

1995-1997

Thin Film Maint

Novellus Systems 1997-1999

Field Service Eng

WJ / SVG / ASML / Aviza

1999-2009

Final Test Technician - WJ

Field Service “WJ Hot Shot” Team

Asia Tech Support Manager

Fab-Finder, Inc

2009-2014

2011-Current High Tech Equip.

Consulting

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Todd O. Curtis Companies-Position-R&D Sites

Technicon 1971 Electrician

Hewlett-Packard 1973-1978

LED Epi & Xtal Growth Ops.

Siemens Opto 1978-1979

GaAsP Epi R&D

Fairchild Opto 1979-1982

LPE, MOCVD III-V EPI R&D

Avantek GaAs 1982-1983

Military GaAs Epi & Implant

Dexcel-Gould 1983-1986

Military GaAs AsCl3 Epi & Dev.

Si-Fab 1986-1988 Silicon Fab Equipment

WJ Microwave 1988-89 Military

III-V MBE

WJ Semi. Equip. 1989-2000

APCVD, MOCVD Apps. Lab R&D

ASML Thermal 2000-2003

ALD, APCVD, MOCVD R&D

Consulting 03-06

Genus-Aixtron 2006-2007

ALD R&D CVD W

2007-Current Used Equip. Technical Consulting

© 2014 88 Equipment 9/18/2015 5CONFIDENTIAL

Todd O. Curtis: Expanded Bio

Todd started his semiconductor career in 1973 at the Hewlett-Packard Opto-Electronics Division in Palo Alto California. He spent the next 15 years in L.E.D. and MESFET III-V materials production and development epitaxial operations at such notable companies as Siemens, Fairchild, Avantek, Gould-Dexcel, and Watkins-Johnson Microwave Group.

In 1989 he began his silicon materials career in Watkins-Johnson Semiconductor Products Division in Scotts Valley California at the cusp of the industry evolution from 150mm to 200mm wafers. Todd spent the next 15 years with Watkins-Johnson in equipment and process engineering working in production and R&D device and materials operations. Todd worked with and co-published technical papers with companies world-wide including INTEL, TSMC, UMC, Texas Instruments, ST Microelectronics, Motorola, IBM, Chartered, Samsung, Sematech, SMIC, Toshiba, Sony, and NEC.

His process development work in the early 1990’s on STI (shallow trench isolation), ILD (inter-level dielectrics) and IMD (inter-metal dielectrics) became mainstream production processes used in over 80% of the semiconductor factories world-wide. His last R&D project was at the 22 nano-meter technology node for ALD (atomic layer deposition) for high-K gate dielectrics and ALD tunable work-function metal gates.

His 40+ years of materials research and production experience includes III-V's for L.E.D. and MESFET's, and over 30 types of silicon related oxides, nitrides, and metals utilized in front-end and back-end applications.

He has been an independent technology consultant since 2003 for equipment and process in the fields of semiconductor, solar, and LED operations. He has lived in Taiwan since the year 2000 and travels frequently to Vietnam in support of his current projects.

© 2014 88 Equipment 9/18/2015

GaAs ~ III-VProcess, Materials, Device, Equip.

CONFIDENTIAL 6

Hewlett-Packard 1973-1978

Epi & Xtal Growth GaAs, GaAsP, GaP

Siemens Opto 1978-1979

GaAsP VPE Epi R&D

Fairchild Opto 1979-1982

LPE, MOCVD III-V EPI R&D

Ternary & Quaternary

Avantek Microwave 1982-1983

Military GaAs VPE Epi & Implant

Dexcel-Gould 1983-1986

Military GaAs AsCl3, MBE Epi & Device Process

WJ Microwave 1988-89 Military

III-V MBE

Genus-Aixtron 2006-2007

ALD & EPI R&D MOCVD

Over 15 yrs. of III-V Experience

Process Materials Device Equipment

AVANTEK

© 2014 88 Equipment 9/18/2015

GaAs ~ III-VProcess, Materials, Device, Equip.

CONFIDENTIAL 7

Process

Epitaxy

MBE-MOCVD

LPE-VPE

Cl3 & AsCl3

Solid and Semi Solid Sources

Materials

GaAs

GaAsP

GaP

AlGaAs

InAlGaAs

P or N Doped

Device

L.E.D.

MESFETS

Lo-noise Power

T and Y-gates Air Bridges

HEMT-Quad-Layers

Equip.

Reactors

Metals

Metrology

Parametric Test

Cleans

All Types

© 2014 88 Equipment 9/18/2015 8CONFIDENTIAL

Dr. Len Mei joins 88 Equipment as Key Advisor for International Business and Technology

Feb 15

Dating back to the early 1980’s, Dr. Mei has been at the forefront of advanced semiconductor development and manufacturing on an International scale with over 30+ years of academic and industrial experience in semiconductors. Fab director at Read-Rite California, managing thin film disk head fab ops and dev. Process manager at Fairchild Semiconductor for advanced memories . Process manager at Data General for microprocessor development and pilot line. Director of planning at Elebra, designing the first 8” advanced wafer for Brazil in 1987.

In academics, he has been a professor at the University of Campinas, Brazil and a visiting Research Associate Professor at Stanford Electronics Lab, Department of EE - Stanford University.

From 1997-2009: EVP of Operations and Business Development for ProMOS Technologies - responsible for all

aspects of ProMOS manufacturing operations including four front end wafer fabs with total capacity exceeding 80K/month 12” wafers and back end operation, product engineering, strategic planning, automation for equipment, factory and data. He managed up to 4,000 head-count and 65 nm technology in volume production with annual capex exceeding $1 billion.

After 2006, Dr. Mei became responsible for new technology and business development at ProMOS. In this capacity, he founded CapsoVision, a company dedicated for the research and production of

capsule camera for medical applications. CapsoVision’s device is pending on FDA approval in

2015.

Dr. Mei holds more than 20 US international patents in semiconductor technology and is the author of the book "Practices of Wafer Fab Operations“.

He received his Ph.D. in Metallurgy from University of Illinois at Urbana-Champaign, USA.

© 2014 88 Equipment 9/18/2015 9CONFIDENTIAL

Michel D. Ouaknine Companies-Position

Dyna Electronique 1972-1974

Design Mngr.

Intel 1974-1977

Apps. Engineer

Intersil1977-1982

Applications Manager

Zilog 1982-1983

Applications Manager

Western Digital 1984-1990

Managing Director

Genus Inc. 1992-1996

Europe Director of Operations

Mattson Technology 1996-2001

RTP Sales Manager

WaferMasters2001-2004

Europe Operations Manager

EU Operations & Technology Consultant

2004 to current