01-mstp+ product overview
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www.huawei.com
INTERNAL
HUAWEI Confidential HUAWEI TECHNOLOGIES Co., Ltd.
23/4/28
MSTP+ Product Overview
MSTP Product Team, Network Product Service Dept.
HUAWEI TECHNOLOGIES CO., LTD. Page 3
With NG-SDH V100R009C03 as the first version, the MSTP+ products have the packet switching feature and support the smooth upgrade of MSTP equipment to MSTP+ equipment.
Preface
HUAWEI TECHNOLOGIES CO., LTD. Page 4
Before taking this course, you should have the following knowledge: Basics on SDH, Ethernet, and MPLS Related knowledge on MSTP products
Guidance
HUAWEI TECHNOLOGIES CO., LTD. Page 5
After taking this course, you are supposed to reach the following objectives: Be familiar with orientation and features of the MSTP+
products. Understand networking application scenarios and service
features of the MSTP+ products. Understand the hardware features of the MSTP+ products.
Objectives
HUAWEI TECHNOLOGIES CO., LTD. Page 6
Part I Features of MSTP+ ProductsPart I Features of MSTP+ Products
Part II Application Scenarios of MSTP+ Products
Part III Feature Overview of MSTP+ Products
HUAWEI TECHNOLOGIES CO., LTD. Page 7
What Is MSTP+? MSTP+ = MSTP + PTN
MSTP equipment can be smoothly upgraded to MSTP+ equipment, which has the PTN features. That is, MSTP can be smoothly upgraded to PTN.
The focus of the upgrade is to reconstruct the cross-connects for MSTP equipment.
With the TDM features unchanged, the new cross-connect boards integrate the core chips used for the PTN equipment. Then, one cross-connect board has dual cores. This enables profound evolution of MSTP.
MSTP+ equipment derives from MSTP equipment and is compatible with all the features currently available on MSTP .
MSTP equipment can be upgraded to MSTP+ equipment by alternatively upgrading the active and standby cross-connect boards. In addition, MSTP+ equipment supports the packet plane, where the data services can be directly added. This solves the problem of inability to multiplex SDH rigid channels.
Dual-core: TDM core + PTN core, processing TDM and packet services at the same time .One-heart (EOD): Data services freely flow. During upgrade, the TDM plane and packet plane can seamlessly interoperate.
HUAWEI TECHNOLOGIES CO., LTD. Page 8
Values of MSTP+ Products
• Provides and optimizes the IP RAN solution.– Is oriented to broadband on mobile networks.
• Transports data services, which require high bandwidth, with low costs.
• Realizes carrier-class transport on mobile networks in aspects such as clock and
QoS.
• Inherits years of maintenance experience of carrier networks.
– Realizes evolution of carrier networks towards all-IP and achieves sharing of 90% 2G,
3G, and LTE sites.
• Realizes evolution towards all-IP through the MSTP equipment in large-scale
deployment and protects existing investment.
• What architecture should the MSTP products to be purchased have to support
evolution to all-IP?
• Integrates the PTN features on the traditional MSTP products to support smooth evolution of MSTP products.
HUAWEI TECHNOLOGIES CO., LTD. Page 9
Native packetNative TDM
End-to-end management and control
Low TCO in the entire life cycle
Dual cores (TDM and packet)
Supports smooth upgrade Is compatible with MSTP
End-to-end management TDM plane and packet plane
Uniform control platform based on GMPLS Uniform NMS
PTN features of MSTP +
Completely compatible with NG-SDH, embedded microwave, and embedded WDM
Smooth upgrade
A packet core is added on the basis of the original TDM core. The former can process packet services based on MPLS.
The TDM and packets services can be groomed through either core.
Supports native FE/ GE/10GE. Supports MPLS and improves efficiency by packet
transport. Supports the packet synchronization clock solution. Achieves the best cost-effectiveness of packet transport.
Supports native E1, T1, STM-1, STM-4, STM-16, and STM-64
Achieves the lowest TCO for TDM transport
TDM + packet switching
PWE3
ATM/EOS
Ethernet
Architecture of MSTP+ products PTN features of MSTP+ products:
TDM/packet dual cross-connect matrixes Uniform platform, synchronization of dual
clocks, and access of multiple clocks End-to-end ASON/GMPLS
TDMATM/EOS
Features of the MSTP+ Products
HUAWEI TECHNOLOGIES CO., LTD. Page 10
Version Orientation and Roadmap of NG-SDH Products
NG-SDH V1R9C02
2008.12 2010.05 2011.06
NG-SDH V1R10
2010.01
NG-SDH V2R11 Full series of NG-SDH products: global version with the MSTP+ features
NG-SDH V2R12
NG-SDH V1R9C03 OptiX OSN1500/3500: global version with the MSTP+ features
2009.06
V1 software platform
V2 software platform
In-development version
Planned version
Sales of V1R9C03 is restrained and V1R9C03 is to be substituted by V2R11.
HUAWEI TECHNOLOGIES CO., LTD. Page 11
Smooth Upgrade (Example: OptiX OSN 3500)
TDM
TDM
P&T
P&T
GSCC
GSCC
E1
EOS
GE
FE
FE
GE
10GE
10GE
CES
SMARTE1
PIU
PIU
AUX
WPWP
GE
10GE
Step 1 Replace the standby TDM cross-connect board with a dual-core cross-connect board. Then, switch the services from the active TDM cross-connect board to the dual-core cross-connect board.
Step 2 Replace the active TDM cross-connect board with a dual-core cross-connect board. Then, switch the services from the standby dual-core cross-connect board to the active dual-core cross-connect board. The switching time is less than 50 ms.
When configured with PTN service processing boards, the equipment can be used to build a PTN network without any impact on the existing TDM services.
STM-n
STM-n
SMARTE1
STM-n
STM-1/4
STM-
16/64
1. After replacing the cross-connect boards, upgrade the software of all the boards housed on the NE to version R9C03.
2. The SCC boards of the OptiX OSN 3500 can be replaced or not. If they are replaced, the product specifications are different.
3. Replace the PIU boards with ones of large power consumption (optional).
HUAWEI TECHNOLOGIES CO., LTD. Page 12
Part I Features of MSTP+ Products
Part II Application Scenarios of MSTP+ Part II Application Scenarios of MSTP+ ProductsProducts
Part III Feature Overview of MSTP+ Products
HUAWEI TECHNOLOGIES CO., LTD. Page 13
Overview of MSTP+ Networking - Coexistence of TDM and Packet Planes
10GE
STM-16/64
STM-1/4
BTS
E1
OSN 3500 OSN 3500
When IP-orientation of the entire network is complete, the MSTP equipment can be further transformed into packet-only equipment to meet the transport requirements of new services.
Aggregation node
OptiX OSN 3500/1500/M1000
Packet XC
TDM XC
STM-1/4/IMA E1/Native E1
STM-16/64
GE/10GE
TDM&packet dual-plane cross-connect board
FE/GE
OSN 1500 Metro1000
OSN 1500 Metro1000
NodeBFE
GE Ring
RNC BSC
BTS E1
NodeBFE
NodeBFE
RN
C
New packet services raise new requirements on the transport network with respect to bandwidth utilization, service management, protection, and equipment maintenance. Hence, the traditional network has to be re-constructed for packet services.
For co-existence of new and old services, the MSTP equipment on the existing network should be upgraded to the MSTP+ equipment with dual planes. Then, the SDH services on the existing network are not affected and a better bearer can be provided to the new packet services.
HUAWEI TECHNOLOGIES CO., LTD. Page 14
If certain equipment on the existing network is not suitable for upgrade, the other equipment can be upgraded for hybrid networking with PTN products.
At the aggregation layer, the equipment can be upgraded to MSTP+ equipment and the capacity can be expanded by using 10GE boards. Then, the equipment can be networked with the OptiX PTN 3900 to build a 10GE ring network.
At the access layer, the OptiX OSN 1500 or OptiX Metro 1000 can be networked with the OptiX PTN 910/950/1900 to build a GE ring network, which is connected to the aggregation layer.
The T2000 can manage both the PTN and MSTP+ products.
MSTP+ Product Networking – Hybrid Networking with PTN Products
10GE
STM-1/4
STM-16/64
BTS
E1
GE Ring
NodeB
FE
OSN 3500
PTN 3900
NodeB
FE
OSN 1500 Metro1000
PTN 950/1900
PTN 910/950/19000
RNC BSC
OSN 3500OSN 1500
Metro1000
BTS
E1
NMS/T2000
NodeB
FE
OSN 1500 Metro1000
HUAWEI TECHNOLOGIES CO., LTD. Page 15
Part I Features of MSTP+ Products
Part II Application Scenarios of MSTP+ Products
Part III Feature Overview of MSTP+ Part III Feature Overview of MSTP+ ProductsProducts
HUAWEI TECHNOLOGIES CO., LTD. Page 16
Hardware Structure of the MSTP+ Products
HUAWEI TECHNOLOGIES CO., LTD. Page 17
SynchronizationModule
System Control
TDM
& Packet
Switch Fabric
Overall Hardware Structure of the MSTP+ Products
TDM
& Packet
switch fabric
TDM/ATM
EoS TDM
TDM
TDM/ATMPWE3
Ethernet
Ethernet
Ethernet
Synchronizationmodule
TDM-only processing board
Packet-only processing board
Packet & TDM processing board
The cross-connect boards with dual planes can be used to cross-connect TDM services and switch packet services at the same time.
Time synchronization and frequency synchronization can be performed on the TDM plane and packet plane.
System control
Auxiliaryunit
HUAWEI TECHNOLOGIES CO., LTD. Page 18
Inter-Connections of the Boards with Packet Features
Packet
TDM
Switch fabric
PEFS8
PEGS2
PEG16PETF8
EOD41
GE
FE
STM-1/STM-4
PEX110GE
GE
FE
PEX1
PEG16
PEGS2
10GE
GE
GE
Client network
Carrier network
OSN 1500
OSN 3500
HUAWEI TECHNOLOGIES CO., LTD. Page 19
Interconnections of the Boards with TDM Features
Switch fabric
TDM
SL1/SLQ4
EAS210GE
STM-16/STM-64
STM-1/STM-4
SL64
SL4
STM-64
STM-16
STM-4SL16/64
SL16EFF8
FEEMS4
FE
GE
ETF8
D12S
E1PQ1E1
D75S
PKT
Client network
Carrier network
HUAWEI TECHNOLOGIES CO., LTD. Page 20
Specifications of the OptiX OSN 3500
HUAWEI TECHNOLOGIES CO., LTD. Page 21
Slot Configuration of the OptiX OSN 3500
GSCC
AUX
PIUA
PIUA
200GTDM
&80G
Packet
Service processing board•PEG16•PEX1
Cross-connect board
Interface board•EOD41•EFT8
System control board•GSCC
Service processing board with interfaces
Service processing board with interfaces
HUAWEI TECHNOLOGIES CO., LTD. Page 22
Slot Capacity of the OptiX OSN 3500
P&T
P&T
GSCC
GSCC
SLOT2
SLOT1
SLOT3
SLOT4
SLOT
13
SLOT
11
SLOT
12
SLOT
14
SLOT
15
SLOT
16
SLOT5
SLOT6
SLOT7
SLOT8
PIUA
PIUA
AUX
SLOT19
SLOT20
SLOT21
SLOT22
SLOT23
SLOT24
SLOT25
SLOT26
SLOT29
SLOT30
SLOT31
SLOT32
SLOT33
SLOT34
SLOT35
SLOT36
200G 200G
5G5G 5G 5G10G 10G 20G 20G 20G 20G 10G 10G 5G5G
TDM
TDM
GSCC
GSCC
SLOT2
SLOT1
SLOT3
SLOT4
SLOT
13
SLOT
11
SLOT
12
SLOT
14
SLOT
15
SLOT
16
SLOT5
SLOT6
SLOT7
SLOT8
PIUA
PIUA
AUX
SLOT19
SLOT20
SLOT21
SLOT22
SLOT23
SLOT24
SLOT25
SLOT26
SLOT29
SLOT30
SLOT31
SLOT32
SLOT33
SLOT34
SLOT35
SLOT36
P&T
P&T
80G 80G2.5G2.5G2.5G5G 5G 5G 5G 5G 5G 5G 5G 5G 5G
2.5G
Packet switching capacity: 80G TDM cross-connect capacity: 200G
HUAWEI TECHNOLOGIES CO., LTD. Page 23
Specifications of the OptiX OSN 3500 (I)
5G 5G 5G 10G 10G10G 40G 40G
XCS
200G
XCS
200G
40G 40G 10G 10G10G 5G
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16SC
C
SCC
17 18
5G 7.5G 10G 10G 10G 7.5G
10G
1 2 3 4 5 6 7 8 11 12 13 14 15 16
PSCC
PSCC
17 18
21 22 25 26 29 30 33 34
Data board
TDM board
Cross-connect board
Data interface board
• TDM cross-connection
• Packet switching
9 10
PSXCS
60G
PSXCS
60G
HUAWEI TECHNOLOGIES CO., LTD. Page 24
Specifications of the OptiX OSN 3500 (II)
•List of new boards
•Specifications of the OptiX OSN 3500
Board Name Slot Type Valid Slot Specification
SSN1PSXCS 9/10 Dual-plane cross-connect board: 200G higher order capacity + 20G lower order capacity + 60G packet switching capacity
SSN4GSCC 17/18 High-performance SCC: memory increased from 256M to 512M
SSN1PEG16 Dual slots 1-2, 3-4, 5-6, 13-14, 15-16 16 x GE processing board, the first two ports on which support the IEEE 1588v2 function.
SSN1PEX1 Dual slots 1-2, 3-4, 5-6, 7-8, 11-12, 13-14, 15-16 1 x 10GE processing board, which supports the IEEE 1588v2 function
SSN1PETF8 21/22/25/26/29/30/33/34 8 x FE interface board, which is used with the PEG16. On ports on the board support the IEEE 1588v2 clock.
SSN1EOD41 21/22/25/26/29/30/33/34 2 x 155M/622M interface board, which works with the PEG16 to classify E1 and Ethernet service flows.
Maximum Configuration
Product SSN1PEG16 SSN1PEX1 SSN1PETF8 SSN1EOD41 10GE GE FE EOS Switching Capacity
3500 5 5 8 8 5 80 64 16Switching capacity: 80GAccess capacity: 60G
HUAWEI TECHNOLOGIES CO., LTD. Page 25
Typical Configuration of the OptiX OSN 3500
ConfigurationApplication
Scenario Typical Configuration Front View
Configuration for TDM + packet switching
Single 10GE ring
Data board: 2 x 10GE + 32 x GE +32 x FETDM board: Housed in slots 1, 2, 7, 8, 11, and 12, the TDM boards can be used to build a 10G SDH ring and to add/drop services.
Data board: 2 x 10GE + 16 x GE +16 x FETDM board: Housed in slots 1, 2, 7, 8, 11, 12, 15, and 16, the TDM boards can be used to build a 10G SDH ring and to add/drop services.
Configuration for packet-only switching
Single 10GE ring
Data board: 2 x 10GE + 48 x GE +48 x FE
Dual 10GE rings
Data board: 4 x 10GE + 16 x GE +16 x FE
10G
5G
15
16
40G
40G
11
12
40G
40G
7 87.5G
10G
PSXCS
60G
PSXCS
60G 10G
3 4 5 69 1
013
14
PSCC
PSCC
17
18
21 22
PEX1 PEX1PEG16
PETF8
PETF8
5G 5G
1 2
40G
40G
11
12
40G
40G
7 8
7.5G
10G
PSXCS
60G
PSXCS
60G 7.5G
10G
3 4 5 69 1
013
14
15
16
PSCC
PSCC
17
18
21 22 33 34
PEX1 PEX1PEG16 PEG16
PETF8
PETF8
PETF8
PETF8
5G 5G
1 2
10G
10G
PSXCS
60G
PSXCS
60G 10G
7.5G
10G
1 2 3 4 5 6 7 89
10
11
12
13
14
15
16
PSCC
PSCC
17
18
33 34
PEX1 PEX1PEG16 PEG16
PETF8
PETF8
PEG16
25 26
PETF8
PETF8 29 30
PETF8
PETF8
Data board TDM board Cross-connect board
Data interface board
10G
10G
PSXCS
60G
PSXCS
60G 10G
7.5G
10G
1 2 3 4 5 6 7 89
10
11
12
13
14
15
16
PSCC
PSCC
17
18
33 34
PEX1 PEX1PEX1 PEG16
PETF8
PETF8
PEX1
HUAWEI TECHNOLOGIES CO., LTD. Page 26
Structure of the Dual-Plane Cross-Connect Board (SSN1PSXCS)
Packet cross-connect module
Synchronization timing module
Control information processing
Module
Backplane
PSXCS
CELL
TDM cross-connect module
PEG16 Card
SL16 Card2.5G
Communication and control
module
HUAWEI TECHNOLOGIES CO., LTD. Page 27
Specifications of the Dual-Plane Cross-Connect Board for the OptiX OSN 3500
Key specifications:
– Performs 200 Gbit/s VC-4 higher order cross-connection, 20
Gbit/s VC-3/VC-12 lower order cross-connection, and 60
Gbit/s packet cross-connection.
– Supports the synchronous Ethernet clock.
– Supports the IEEE 1588V2 clock.
– Consumes a maximum of 90 W power.
For smooth evolution of the MSTP equipment, the original cross-
connect board needs to be replaced.
– For details on the restrictions, see the Services and
Networking Application of MSTP+ Equipment.
HUAWEI TECHNOLOGIES CO., LTD. Page 28
Specifications of the SSN1PEX1 Board
Key specifications:– Provides one 10GE optical interface, which can be a colored optical
interface and can access or process 1 x 10GE services. The board processes the 10 Gbit/s services in full-duplex mode.
– Supports three types of Ethernet services, E-Line, E-LAN, and E-AGGR.– Supports synchronous Ethernet and IEEE 1588V2.– Supports ETH-OAM, MPLS-OAM, and H-QoS– Supports spanning tree and IGMP Snooping.– Supports 1+1/1:1 MPLS tunnel protection and LAG protection.– Consumes a maximum of 107 W power in room temperature (25 )℃
Slot restrictions:– Two slots house one SSN1PEX1 board. The logical slot of the
SSN1PEX1 board is the slot with an odd number.
Valid Slot Slots 1-2 Slots 3-4 Slots 5-6 Slots 7-8 Slots 11-
12
Slots13-
14
Slots 15-16
Logical Slot Slot 1 Slot 3 Slot 5 Slot 7 Slot 11 Slot 13 Slot 15
HUAWEI TECHNOLOGIES CO., LTD. Page 30
Specifications of the SSN1PEG16 Board
Key specifications:– Provides 16 GE ports and supports colored interfaces. One PEG16
board can work with two PETF8 boards.
– Supports three Ethernet service types, that is, E-Line, E-LAN, and E-
AGGR.
– Supports synchronous Ethernet and IEEE 1588V2 (first two GE ports).
– Supports ETH-OAM, MPLS-OAM, and H-QoS.
– Supports spanning tree and IGMP Snooping.
– Supports 1+1/1:1 MPLS tunnel protection and LAG protection.
– Consumes a maximum of 137 W power at room temperature (25ºC).
5G 7.5G 10G 10G PSXC
S 60G
PSXC
S 60G
10G 7.5G10G
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
PSCC PSCC
17 18
21 22 25 26 29 30 33 34
HUAWEI TECHNOLOGIES CO., LTD. Page 31
Specifications of the SSN1PETF8 Board
Key specifications:– Accesses 8 x FE services and works with the PEG16 board to
process services.
– Supports three Ethernet service types, that is, E-Line, E-LAG, and E-
AGGR.
– Supports synchronous Ethernet and IEEE 1588v2.
– Supports ETH-OAM, MPLS-OAM, and H-QoS.
– Supports spanning tree, and IGMP Snooping.
– Supports 1+1/1:1 MPLS tunnel protection and LAG protection.
– Consumes a maximum of 13 W power at room temperature (25ºC).
HUAWEI TECHNOLOGIES CO., LTD. Page 32
Specifications of the High-Performance SCC Board (N4GSCC) for the OptiX OSN 3500
To upgrade the MSTP equipment to MSTP+ equipment, the SCC board does not need to be replaced. The differences of the specifications of the N1/N3GSCC and N4GSCC are as follows:
Number of PWs/Tunnels
N1/N3GSCC
N4GSCC
L2VPN N1/N3GSCC N4GS
CCQoS N1/N3
GSCC N4GSCC
Max. number of QinQs supported by equipment (NNI side)
1024 1024Number of VUNIs 2K 8K Number of CARs for flow
classification
2K 8192
Number of MPLS tunnels 1K 4096 Number of VNNIs 3216 17552 Max. number of ACLs 1K 8192
Max. number of PWs supported by equipment 2048 16384 Number of VUNI groups 1024 1024 Number of port WRED
policies
7 7
Number of tunnel OAMs 512 2048 Number of E-LINE
services
2K 4096 Number of service WRED
policies
127 127
Number of APS protection groups 256 1024 Number of E-LAN
services
512 1024 Number of WFQ templates 256 256
ETH-OAMN1/N3GSCC
N4GSCC
Number of E-AGGR
services
4 4 Number of VUNI egress
policies256 256
Number of MDs 64 64Number of multicasts 1024 4096 Number of VUNI ingress
policies256 256
Number of MAs 1024 1024Number of multicast
members
4K 24K Number of port policies 100 100
Number of MPs 1024 2048 Number of PW policies 256 256
Number of port flow
classifications
1600 1600 Number of QinQ policies 256 256
VUNI ingress flow
classifications4K 8K
Number of DiffServ
domains
8 8
HUAWEI TECHNOLOGIES CO., LTD. Page 33
Specifications of the PIUA Board
The PIUA board is not a new board for the OptiX OSN 3500
V100R009C03. From February 2008, the delivery switchover started. On
the existing network, 60% of the power boards are the PIUA boards.
To upgrade the OptiX OSN 3500 to MSTP+ equipment, the PIU board
must be replaced with the PIUA board.
Restrictions:Neither the PIU nor the PIUA supports remote identification. Hence, they
need to be identified on site.
Product Power Consumption PIU Type Backplane Version Remarks
OptiX
OSN
3500
650 W N1PIU
(650 W)
N1AFB VER.B (1100 W) Old version on the
existing network
1100 W N1PIUA
(1100 W)
N1AFB VER.C (1400 W) New version on the
existing network
HUAWEI TECHNOLOGIES CO., LTD. Page 35
Specifications of the OptiX OSN 1500
HUAWEI TECHNOLOGIES CO., LTD. Page 36
Slot Configuration of the OptiX OSN 1500
AUX
PIU
PIU
20G TDM & 8G packet
Service sub-board:•PEFS8
AUX
PIU PIU
20G TDM & 8G Packet
Service sub-board:•PEFS8
Cross-connect board:•PCXLN
Interface board
OptiX OSN 1500B
OptiX OSN 1500A
Service board (one slot dividable to two sub-slots):•PEGS2
Cross-connect board:•PCXLN
Service board (one slot dividable to two sub-slots):•PEGS2
HUAWEI TECHNOLOGIES CO., LTD. Page 37
Slot Capacity of the OptiX OSN 1500A
Slot 20FAN
Slot 1 PIU Slot 11 PIU Slot 6 1.25G
Slot 7 1.25G
Slot 8 1.25G
Slot 9 1.25GSlot 10 AUX
Slot 2/12 2.5GSlot 3/13 2.5G
P&T 20GP&T 20G
Slot 20FAN
Slot 1 PIU Slot 11 PIU Slot 6 1G
Slot 7 1G
Slot 8 1G
Slot 9 1GSlot 10 AUX
Slot 2/12 2GSlot 3/13 2G
P&T 8GP&T 8G
Packet switching capacity: 8G
TDM cross-connect capacity: 20G
HUAWEI TECHNOLOGIES CO., LTD. Page 38
Slot Capacity of the OptiX OSN1500B
Slot20FAN
Slot 6 622MSlot 7 622MSlot 8 622MSlot 9 622MSlot 10 AUX
Slot 2/12 2.5GSlot 3/13 2.5G
P&T Slot 4 20GP&T Slot 5 20G
Slot 1/11 2.5G
Slot 17
Slot 16
Slot 15
Slot 14
Slot 19 PIU
Slot 18 PIU
Slot 20FAN
Slot 6 1GSlot 7 1GSlot 8 1GSlot 9 1G
Slot 10 AUX
Slot 2/12 2GSlot 3/13 2G
P&T Slot 4 8GP&T Slot 5 8G
NA
Slot 17
Slot 16
Slot 15
Slot 14
Slot 19 PIU
Slot 18 PIU
Packet switching capacity: 8G TDM cross-connect capacity: 20G
HUAWEI TECHNOLOGIES CO., LTD. Page 39
Specifications of the OptiX OSN 1500 (I)
Slot capacity of the OptiX OSN1500A Slot capacity of the OptiX OSN1500B
XCS A XCS B
20
1 11 6
2/12 7
3/13 8
4 9
5 102.5G
2.5G
2.5G ( 2GE)2.5G ( 2GE)
1.25G ( 1GE)PIU PIU
FAN
AUX
1.25G ( 1GE)1.25G ( 1GE)1.25G ( 1GE)
Slot for a packet and TDM cross-connect board
Slot for a TDM board Slot for an integrated board of cross-connect, SCC, and line units
1418 PIU
15
16
17
Slot 20
FAN
1/11
2/12
3/13
4
19 PIU
6
7
8
9
10 AUX5
2.5G
2.5G
2.5G
622M ( 1GE)2.5G ( 2GE)2.5G ( 2GE)
622M ( 1GE)622M ( 1GE)622M ( 1GE)
TDM interface board
TDM interface board
TDM interface board
TDM interface board
HUAWEI TECHNOLOGIES CO., LTD. Page 40
Specifications of the OptiX OSN 1500 (II)
List of new boards:Board Size Valid Slot Specification
SSR1PCXLN 6U 4/5 Dual-plane cross-connect board: 20G higher order + 20G lower order +
8G packet
SSR1PEGS2 6U 2/3 2 x GE processing board (full slot): supporting the IEEE 1588v2 function
at two ports
SSR1PEFS8 3U 12/13, 6/7/8/9 8 x FE processing board (sub-board): supporting the IEEE 1588v2
function at all the eight ports
SSR1PEGS1 3U 2/3/12/13,
6/7/8/9
1 x GE processing board (sub-board): supporting the IEEE 1588v2 clock.
Maximum Configuration/Product SSR1PEGS2 SSR1PEGS1 SSR1PEFS8
GE Interface
FE Interface Packet Switching Capacity
OptiX OSN 1500 A/1500B 2 8 6 8 48
Switching capacity: 8G
Access capacity: 7G
Specifications of the OptiX OSN 1500:
HUAWEI TECHNOLOGIES CO., LTD. Page 41
Typical Configuration of the OptiX OSN 1500
Type ScenarioTypical
ConfigurationFront View of the OptiX OSN
1500AFront View of the OptiX OSN
1500B
TDM + packet cross-connection
Single GE ring
2 x GE + 16 x FE +10G TDM service (1500A) or 2.5G TMD service (1500B)
Dual GE rings
4 x GE + 16 x FE + 17.5G TDM service (1500A) or 10G TDM service (1500B)
Packet-only cross-connection
Dual GE rings
4 x GE + 32 x FE + 5G TDM service (1500A) or 7.5G TDM service (1500B)
Common slot for packet and TDM TDM only
XCS B
Slot20
6
7
8
9
10
1GEXCS A 1 11
2/12
3/13
4
5 2.5G
2.5G
2.5G
2.5G
PIU PIU
FAN
AUX
1GE
1GE
1GE PEGS1
PEGS1
PEFS8
PEFS8
Slot 20
FAN
6
7
8
9
10 AUX
1/11
2/12
3/13
4
5
2.5G
2.5G
2.5G
2.5G
2.5G
18 PIU
19 PIU
14151617
TDM interface boardTDM interface board
TDM interface boardTDM interface board
PEGS1
PEGS1
PEFS8
PEFS81GE
1GE
1GE
1GE
XCS B
Slot20
6
7
8
9
10
1GEXCS A 1 11
2/12
3/13
4
5 2.5G
2.5G
2.5G
2GE
PIU PIU
FAN
AUX
1GE
1GE
1GE PEGS1
PEGS1
PEFS8
PEFS8
PEGS2Slot 20
FAN
6
7
8
9
10 AUX
1/11
2/12
3/13
4
5
2.5G
2.5G
2.5G
2.5G
2GE
18 PIU
19 PIU
14151617
TDM interface boardTDM interface board
TDM interface boardTDM interface board
PEGS1
PEGS1
PEFS8
PEFS81GE
1GE
1GE
1GE
PEGS2
XCS B
Slot20
6
7
8
9
10
1GEXCS A 1 11
2/12
3/13
4
5 2.5G
2.5G
2GE
PIU PIU
FAN
AUX
1GE
1GE
1GE PEFS8
PEFS8
PEFS8
PEFS8
PEGS2
2GE PEGS2
Slot 20
FAN
6
7
8
9
10 AUX
1/11
2/12
3/13
4
5
2.5G
2.5G
2.5G
2GE
18 PIU
19 PIU
14151617
TDM interface boardTDM interface board
TDM interface boardTDM interface board
PEFS8
PEFS8
PEFS8
PEFS81GE
1GE
1GE
1GE
PEGS2
2GEPEGS2
HUAWEI TECHNOLOGIES CO., LTD. Page 42
Structure of the Cross-Connect Board for the OptiX OSN 1500
Packet cross-connect module
Synchronization timing module
Communication and control
module
Backplane
CXLNP
CELL
TDM cross-connect module
PEG2
SL162.5GO/E
O/E
SDH processing
module
STM-1/4/16
STM-1/4/16
Other boards
HUAWEI TECHNOLOGIES CO., LTD. Page 43
Specifications of the Integrated Board (SSR1PCLN) for the OSN 1500
Key specifications:– Line unit, which receives and transmits 1 x STM-1/STM-4/STM-16
optical signals.
– SCC unit, which supports the packet feature.
– Cross-connect unit, which has the packet and TDM dual planes and
performs 40 Gbit/s VC-4 higher order cross-connection, 20 Gbit/s VC-
3/VC-12 lower order cross-connection, and 8 Gbit/s packet switching.
– Supports synchronous Ethernet and IEEE 1588V2.
Board Logical Board Logical Slot
PCXLN Q2SLN Slots 4 and 5
PCXL Slots 80 and 81
GSCC Slots 82 and 83
HUAWEI TECHNOLOGIES CO., LTD. Page 44
Specifications of the SSN1PEGS2 Board
Key specifications:– Provides two GE optical interfaces, which can be colored optical
interfaces.
– Supports two Ethernet service types, that is, E-Line and E-AGGR.
– Supports synchronous Ethernet and IEEE 1588V2.
– Supports MPLS-OAM and QoS.
– Supports 1+1/1:1 MPLS tunnel protection and LAG protection.
– Consumes a maximum of 9 W power at room temperature (25ºC).
The PEGS2 can be used to build a GE ring network and also to add
or drop GE services.
Note:The PEGS2 board is not a switching board. “S’ in the board name indicates a processing board.
HUAWEI TECHNOLOGIES CO., LTD. Page 45
Specifications of the SSN1PEFS8 BoardKey specifications:
– Provides one Delander high-density interface to input/output 8 x FE signals.
– Supports two Ethernet service types, that is, E-Line and E-AGGR.
– Supports synchronous Ethernet and IEEE 1588V2.– Supports MPLS OAM and QoS.– Supports 1+1/1:1 MPLS tunnel protection and LAG
protection.– Consumes a maximum of 12 W power at room temperature
(25ºC). Note: The length of the Delander connection cable depends on the site
survey and is 1 m by default.
HUAWEI TECHNOLOGIES CO., LTD. Page 46
Service Types and Service Carrying Mode of MSTP+ Equipment
HUAWEI TECHNOLOGIES CO., LTD. Page 47
Metro Ethernet Service (I)
• Metro Ethernet forum (MEF) defines two Ethernet service types:– Ethernet line service: E-LINE
– Ethernet LAN service: E-LAN
E-Line service: point-to-point Ethernet service
P2P EVCs
E-LAN service: multi-point-to-multi-point Ethernet service
MP2MP EVC
HUAWEI TECHNOLOGIES CO., LTD. Page 48
Metro Ethernet Service II
• Ethernet aggregation service: E-AGGR
E-AGGR service: multi-point-to-point Ethernet service
UNIs NNIsUNI
HUAWEI TECHNOLOGIES CO., LTD. Page 49
PSN
Ethernet Service Carrying Modes on PSN
• On a PSN, Ethernet services can be carried by ports, by PWs, or by QinQs.
• The following shows the application of carrying Ethernet services by PWs.
MPLS tunnel
PW1PW2
Port
MPLS tunnel
PW2
PW1
E-LINE service
The Ethernet protocol data units (PDUs) are transported on PSN (Layer 2 MPLS) through pesudo wires (PWs).
HUAWEI TECHNOLOGIES CO., LTD. Page 50
Comparison of Ethernet Service Models
Service TypeService
Multiplexing (Access Side)
Transmission Tunnel
(Network Side)IETF Model ITU-T Model MEF Model
P2P service
Line Physical isolation Physical isolation — EPLE-Line
Virtual Line
Physical isolationVLAN —
EVPL
MPLS VPWS
VLAN
Physical isolation —
VLAN —
MPLS VPWS
MP2MP service
LAN Physical isolation Physical isolation — EPLAN
E-LANVirtual LAN
VLAN
Physical isolation —
EVPLANS-VLAN —
MPLS VPLS
S-VLAN B-MACB-VLAN —
P2MP service
Tree Physical isolation Physical isolation — EPLAN
E-TreeVirtual Tree VLAN MPLS VPLS multi-cast EVPLAN
HUAWEI TECHNOLOGIES CO., LTD. Page 51
Software Features of the OptiX OSN 1500/3500
HUAWEI TECHNOLOGIES CO., LTD. Page 52
Features of the Common Software
Product Feature DescriptionCommon Protection on the
packet planeSupports 1+1/1:1 LSP protection with the switching time less than 50 ms.
MPLS control plane The MPLS (MPLS-TP) control plane supports static configuration.
QOS The OptiX OSN 3500 supports MPLS-based DiffServ , H-QoS, and the ability to configure priorities based on tunnels.The OptiX OSN 1500 supports MPLS-based DiffServ.
MPLS OAM Checks connectivity of LSPs by performing connectivity verification (CV) and fast failure detection (FFD) and performs switching within 50 ms in case of a fault.
ETH-OAM Supports 802.1ag and 802.3ah (not supported by the OptiX OSN 1500).
Packet clock Supports synchronous Ethernet clock and IEEE 1588v2 packet clock.
HUAWEI TECHNOLOGIES CO., LTD. Page 53
Carrier-Class End-to-End Network-Level APS Protection(1+1/1:1 LSP Protection) )
• The fault detection and protection switching are based on hardware. The OAM packets are inserted every 3.3 ms. A fault can be detected within 10 ms and the protection switching can be completed within 50 ms.
• The hardware-based OAM enables multiple LSPs to be switched within 50 ms.
RNC/BSCRNC/BSC
SRSR
PSN WorkingProtection
2G/3G
NGN
VIP private line BRASBRAS
HUAWEI TECHNOLOGIES CO., LTD. Page 54
H-QoS Based on Users and Services
• UNI side: The H-QoS controls small tunnels to ensure QoS for each user and each service.• NNI side: The H-QoS controls large tunnels according to the planning and provides QoS
similar to that of SDH.
Data
Voice
VideoPIR = 6 Mb/sCIR = 6 Mb/s
User VLANCIRPIRCIR = 512 kb/s
PIR = 16 Mb/s
CIR = 2 Mb/sPIR = 2 Mb/s GE
10GESDHOTN
Voice (COS = EF)
Video (COS = AF4)
Data (COS = BE)
UNI: H-QoS
NNI: DS-TE
PTN
NodeB
BTSPTN
SR
RNC
MSCGVIP
HUAWEI TECHNOLOGIES CO., LTD. Page 55
End-to-End OAM Based on Hardware
• End-to-end by-layer monitoring ensures quick fault identification.• The hardware OAM (CPU not involved) avoids software performance
degrade in case of an increase in the OAM services.
Service-layer OAM ( UNI to UNI)
IEEE 802.3ah EFM
ITU Y.1731 OAM Connectivity-layer OAM
IEEE 802.1ag/ITU Y.1731
ITU Y.1730/ITU Y.1711 OAM LSP
PW
PTN
PTN
PTN PTN
NodeB
BTS PTN
SR
RNC
MSCGVIP
EFM
HUAWEI TECHNOLOGIES CO., LTD. Page 56
Clock/Time Synchronization Solution
• The clock/time synchronization solutions are as follows:– IEEE 1588V2 clock, which is co-frequency and in-phase. All the nodes that the
IEEE 1588V2 clock signals traverse must support the IEEE 1588V2 clock.– Synchronous Ethernet clock, which is co-frequency and stable, and is similar to the
SDH clock. All the nodes that the clock signals traverse must support the synchronous Ethernet clock.
FE/GEGE/FE
NodeB
RNC
PTNNodeB
FE/GE
FE/GE BITS
HUAWEI TECHNOLOGIES CO., LTD. Page 57
Appendix I: Service Specifications of Boards
Specification Board
Service Type QoS IEEE1588V2
OAM Spanning
Tree
IGMPSnoopi
ng
Number of 1+1/1:1 MPLS
TunnelProtection
Groups
LAG
E-Line E-LAN E-AGGR
Eth MPLS
OptiX OSN 3500
PEX1 √ √ √ H-QoS √ √ √ √ √ 1k √
PEG16 √ √ √ H-QoS First two
ports
√ √ √ √ 1k √
PETF8 √ √ √ H-QoS √ √ √ √ √ 1k √
OptiX OSN 1500
PEGS2 √ × √ Simple √ × √ × × 128 √
PEFS8 √ × √ Simple √ × √ × × 128 √
HUAWEI TECHNOLOGIES CO., LTD. Page 58
Appendix II: Usage Restrictions on Boards with Packet Features
• The ports on the PETF8/PEFS8 do not support the 10M rate or half-duplex mode.– The NE software suppresses such configuration.
• The following Ethernet ports do not support the function of setting or querying flow control:– IP1/IP2 ports on the PEG16– All ports on the PEX1– All ports on the PETF8– All ports on the PEGS2 and PEGS1– All ports on the PEFS8
• The preceding ports support RMON statistics only on good packets and errored packets.
• In the case of the PEGS1/PEGS2/PEFS8 , the load sharing algorithm does not support the source IP address.
• In MPLS service-carrying mode, the PEG16/PEX1 does not support transparent transmission of BPDUs.
Disclosu
re only to Huaw
ei engineers
HUAWEI TECHNOLOGIES CO., LTD. Page 59
Appendix III: New Maintenance Features of MSTP+ Equipment
• Currently, the MSTP equipment of version V100R009C03 does not support the fiber auto-
search function.
• The MSTP+ equipment does not support the function of uploading or downloading
configuration data to or from the NMS, or pre-configuration. Similar to the ASON features,
only the database upload/download function can be used for disaster tolerance.
• Multiple dynamic protocols are new for the packet features. Hence, in case of a warm
reset, the active and standby SCC boards are switched to reduce impacts on packet
services.
• To upgrade the equipment on the existing network to V100R009C03, which supports the
IEEE 1588 feature, by means of package loading, select proper package files. In addition,
the equipment of version V100R009C03 does not support the license control on the IEEE
1588 feature. Instead, you need to manually control the IEEE 1588 feature.
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23/4/28
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