01-intro mems history trends

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Murat Kaya Yapıcı, Ph.D. EE 404/626 – Introduction to MEMS 1

SABANCI UNIVERSITY

Faculty of Engineering and Natural Sciences

Electronics Engineering EL – 404 Intro to MEMS / EE 626 MEMS

Spring-2016

Course Schedule

Introduction to Microelectromechanical Systems - 20521 - EE 404- 0

Associated Term: Spring 2015-2016Instructors: Murat K. Yapıcı (P)

Scheduled Meeting Times

Type Time Days Where Date Range ScheduleType

Instructors

Class3:40 pm -5:30 pm

T

Fac. of Engin.

and Nat. Sci.L055

Feb 01, 2016 -May 13, 2016

1st delMurat K.Yapıcı (P)

Class12:40 pm- 1:30 pm

FFac. of Engin.and Nat. Sci.L027

Feb 01, 2016 -May 13, 2016

2nd delMurat K.Yapıcı (P)

Introduction to Microelectromechanical Systems - Recitation -

20522 - EE 404R - 0

Scheduled Meeting Times

Type Time Days Where Date Range ScheduleType

Instructors

Class5:40 pm -

7:30 pmF

Fac. of Engin.

and Nat. Sci.G029

Feb 01, 2016 -

May 13, 20161st del

Murat K.

Yapıcı (P)

Office: G045 FENS,

Email: [email protected]


Course Description

Overview of design, manufacture and packaging of microdevices, and nanotechnology.

Major subjects covered in the course include engineering physics and mechanics, scaling

laws for miniaturization, microfabrication techniques, material selection, microsystems

design methodologies, microsystems packaging design, and introduction of

nanotechnology and engineering.

Course Goals

1. To learn about electromechanical design and packaging of microdevices and systems.

2. To learn the basic design principles for MEMS and Microsystems.

3. To learn the basic principles of microfabrication techniques for microdevices and

microsystems, as well as integrated circuits.

4. To learn the basic principles involved in microsystems packaging.

5. To learn the basic principle of nanotechnology, and nanoscale engineering analysis.

mailto:[email protected]:[email protected]


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Student Learning Objectives

1. To be able to explain what MEMS and microsystems are.

2. To explain the working principles of many MEMS and microsystems in the marketplace.

3. To understand the relevant engineering science topics relating to MEMS and microsystems.

4. To be able to distinguish the design, manufacture and packaging techniques applicable

to microsystems from those for integrated circuits.

5. To become familiar with the materials, in particular, silicon and its compounds for MEMS.

6. To be able to explain the basic and relevant design principles of MEMS and microsystems.

7. To learn the scaling laws for miniaturization.

8. To be able to identify the optimal microfabrication and packaging techniques for micro

devices and systems.

9. To be able to handle mechanical systems engineering design of micro scale devices.

10. To learn the fundamentals of nanotechnology.


Textbook:

“Foundation of MEMS,” 2nd edition, by Chang Liu, Pearson, Essex,

England, 2012. (ISBN-10: 0273752243, ISBN-13: 9780273752240)

“MEMS & Microsystems Design, Manufacture, and Nanoscale Engineering,”

2nd edition, by Tai-Ran Hsu, John Wiley & Sons, Inc., Hoboken, NJ. 2008

(ISBN 978-0-470-08301-7)

References:

“Fundamentals of Microfabrications: The Science of Miniaturization,” Marc

J.Madou, Taylor & Francis, Inc., 2002 (ISBN 9780849308260

“Micromachined Transducers Sourcebook,” G. Kovacs, McGraw-Hill, 1998.

“Microchip Fabrication,” 3rd ed., Peter van Zant, McGraw-Hill, 1997.

Grading Scheme:Mid-Term: 30%

HW + Project: 40%

Final: 30%


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Instruction Schedule

1. Introduction – History and Future Trends of MEMS

2. Introduction to Microfabrication3. Introduction to Micromachining

4. Review of electromechanical concepts

5. Introduction to sensors and actuators

6. Electrostatic sensors and actuators

7. Thermal sensors and actuators

8. Piezoresistive sensors

9. Piezoelectric sensors and actuators

10. Magnetic actuators and sensors

11. Bulk micromachining

12. Surface micromachining

13. Process Design – SPM Probe Array, Nanofabrication

14. Polymer MEMS, Microfluidics Applications15. MEMS layout introduction


MEMS Micro Electromechanical Systems)

Microfabrication and Nanotechnology

History and Future Trends


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Outline

• What is MEMS?• Technical terms

• The past and the future – a rapidly developing field

• Pioneer work

• Growth in the 1990’s

• MEMS in the 21st century

• Intrinsic characteristics and issues of MEMS


Get Scales Right

• Units often encountered

• Microscale: 1 m (micron/micrometer) = 10-6 m = 10-3 mm

• Nanoscale: 1 nm (nanometer) = 10-9 m = 10-6 mm = 10-3

m = 10Å

Human hair:

75~100

m

SWCNT: several

nm in diameter

DNA strand:

~10nm


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• Nanotechnology

• Control of matter on the atomic and molecular scale, generally 100 nanometers orsmaller, and the fabrication of devices or materials that lie within that size range.

Technical Terms


• Feature size: 1~100s microns• The dimension of a structure/device which is most critical to its property

or performance (e.g. diameter of your hair)• Feature size is not the size of the entire device.

• Fabrication involving• Micromachining processes

• Microfabrication processes

• A combination of• Micro sensors, actuators and other functional micro structures

• What is a sensor, actuator ? • Micro sensors (mechanical, thermal, chemical electrical)

• Detect a change in its environment in one form of energy and provide a correspondingoutput, usually an electrical signal.

• Micro actuators (other domain mechanical)• Converts energy (electrical, hydraulic fluid pressure, pneumatic pressure) into motion

• Work in multi-energy domains, not just electrical

• Fuzzy boundary

Will be explained in detail,

soon…

What is MEMS ?


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The Integrated Circuit

Circuit Boards

History evolution of MEMS


• Initially evolving from IC field

• Both the materials and fabrication processes are readily available.

• Silicon, silicon oxide, silicon nitride, polysilicon, metal

• Microfabrication technology

• Mass production capability and integration with IC

Drain SourceGate

Conventional MOS transistor

Drain Source

Gate

Resonant gate MOS transistor

IDS=f(VGS, VDS) IDS=f(d,VGS, VDS)

d

• Resonant gate transistor (1967, Harvey Nathanson, Westinghouse)

Then scientists all around started

investigating new small, tiny

devices which they called MEMS

Harvey C. Nathanson (born October 22, 1936) is an American

electrical engineer who invented the first MEMS (micro-electro-

mechanical systems) device of the type now found in consumer

products ranging from cellular phones to digital projectors.

The development history of MEMS


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•

Famous Example: Tiny Gears made at Sandia National Labs.

Small, Tiny Devices

Multiple Gear Speed Reduction Unit Linear rack

Spring Device

Rotary Motor

Six-gear Train


How Small ?

Spider Mite on a Mirror Assembly Mite approaching a

Gear mechanism



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• RF (radio frequency) MEMS• Passive components in integrated wireless systems

• Integrated capacitors, inductors, switches, resonators• Miniaturized antenna and antenna arrays

• BioMEMS• Interacting with micro-scale biological entities

• Micro needles, probes, surgical tools, implantable micro electrodes and sensors

• Micro total analysis systems (TAS)

• Microfluidics• Micro pumps, valves, channels, reservoirs

• MOEMS (micro-opto-electro-mechanical systems)• Optical fiber network, digital light processing, optical sensor

• Micro mirrors/mirror arrays

• Other micro optical components (e.g. binary lens)

• Much more: power-MEMS…

Different Sub-fields of MEMS


• MEMS• Feature size (not device size) ranging from a few to several hundred microns

• Macroscopic theory is still valid.

• NEMS (Nano Electromechanical Systems)• Feature size (not device size) usually 10s of nanometers

• Macroscopic theory may not be valid all the time (e.g. nanoscale flows).

• Use similar fabrication methods (top-down) at smaller scale

Metal nanowire Nanoscale beam structures Nanopore detection for single

amino acid chains

MEMS and NEMS


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What is Nanotechnology ?

• Nanotechnology• Science and engineering to build nanoscale structures and

devices using “bottom-up” fabrication method.• Control the assembly atoms and molecules based on physical,

chemical and biological phenomena and processes.

• MEMS can help nanotechnology research• Serving as an interface between nano and macro worlds.

• Atomic force microscope probes for nano imaging and manipulation

• Tweezers to handle nano objects


Outline

• What is MEMS?

• Technical terms

• The past and the future – a rapidly developing field

• Pioneer work

• Growth in the 1990’s

• MEMS for the 21st century

• Intrinsic characteristics and issues of MEMS


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• Mid-level

• Micro sensors and actuatorsas individual components inlarger systems

• Needs intensive developmentand examples of commercialsuccess

• Grand challenge

– Fully-functional integrated“smart” microsystems

– MEMS in real sense

– A long way to go

• Low “hanging fruits”

– Functional 3Dmicromechanical

structures – Minimum requirement on

materials, processes andequipment

– “Everyone” can do MEMS

N e w a

p p l i c a t i o n s

New design,fabricationand material

• Initially evolved from IC field and grew rapidly

Evolution trend in MEMS


Typical MEMS Application and Commercialization Overview

• Micro sensors• Acceleration sensors for automobile air bag control

• Gyroscopes for automobile driving control

• Pressure sensors for blood, tire, etc.

• Many others underdevelopment

• Micro actuators• Micromachined ink jet head (HP and others, 1978-)

• Digital light processing (TI)

• Micropumps and valves

• Many others underdevelopment

• 3D micro structures• Micro inductors and capacitors

• Scanning probes

• Microfluidic channel networks

• Combination of the above three


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Ink Jet Printing Head

• Ink jet printing head (Hewlett Packard, 1978)

• Arrays of micromachined nozzles

– Eject tiny ink droplets by heating and expanding liquid

– The ink-ejection nozzles can be made extremely small and

densely populated which allows high resolution printing

«To eject a droplet from each chamber, a pulse of current is passed through the

heating element causing a rapid vaporization of the ink in the chamber and

forming a bubble, which causes a large pressure increase, propelling a droplet of

ink onto the paper (hence Canon's trade name of Bubble Jet ). »


Micro Accelerometer and Gyroscope

• Small volume and weight

• Monolithically integrated with signal processing integrated circuits

ADI IMEMS accelerometer ADI IMEMS gyroscope

https://en.wikipedia.org/wiki/Trade_namehttps://en.wikipedia.org/wiki/Trade_name


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• Joysticks- Contain Integrated Accelerometers

• Sensing your motion

Computer games Wii, Playstation


Display

• Texas Instruments

• www.dlp.com

Digital Mirror Device


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Wireless Communication

• Wireless infrastructure: bluetooth, wireless voice/data network

• Applications: wireless internet, smart building, smart highway, wireless sensor network,smart toys, …

• A low cost, high performance, small volume, power efficient front end is key to hardwaresuccess.

• MEMS sensors will make cell phones and computers “smarter” and much more fun to use.


Wireless Communication

• MEMS tunable capacitors, inductors, switches, resonators and antennas enableintegrated wireless communication systems with lower power/cost and higherperformance.


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Data Storage

• MEMS technology has made the hard driverecording/reading heads move faster and more precisely.

• Coarse movement: servo motor• Fine movement: MEMS actuator


Data Storage With Ultra-high Density

• IBM “millipede” data storage device

Record Read

http://ascii24.com/news/i/tech/article/2002/06/11/imageview/images687331.jpg.htmlhttp://ascii24.com/news/i/tech/article/2002/06/11/imageview/images687331.jpg.html


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Micro Air Vehicle and Dynamic Fly Control

• Smart skins for dynamic fly control

• Micro sensors, actuators, power sources for MAVs


Micro Optical Systems

• Electro-optics

• Optical and electrical conversion


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Micro Optical Systems

• Lucent LambdaRouter

• High-speed, low-loss,electrostaticallycontrolled opticalswitch arrays

• Positioning of eachmirror is continuous

http://www.lucent.com/pressroom/lambd

a.html


Microfluidics

• Cell manipulation and sortingfor medical diagnosis (Caltech)

• Portable blood analysis

(www.I-stat.com)

• DNA testing(Affymetrix)


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• Small dimension enable new experiments very difficultor impossible before.

• Small dead volumes reduce the cost.

• Enable portable instruments

• Low cost fabrication leading to disposable devices andhome use.

• Integration makes the experiment much easier

Major Benefits of Microfluidic Systems in Biomedical Applications


Biomedical Applications

• Retina prosthesis

• Neuron probe (U. Michigan)

• Roboroach (Tokyo U.)

• Needles without pain


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• Atomic Force Microscope

• Allows you to image surfaces• Can be used as a printer

Some Nanotechnology Applications


MEMS/Nanotechnology for the 21

th

Century

• Research becomes interdisciplinary; field rapidly expanding to many different expertise.

• Reaching the ultimate goal: Small, low cost, smart devices finding unprecedentedapplications…

• Military: smart ammunition and high-tech soldier uniform

• Biology: cell sorting and manipulation, DNA/protein analysis

• Chemistry: micro chemical systems

• Medicine: micro surgical tools, smart drug delivery (e.g. for the cure of diabetes)

• Homeland defense: distributed environmental sensors with wireless communication

• Gaming and toys: smart gadgets

• Digital or intelligent housing


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Summary

• Early MEMS: IC-derived devices

• MEMS in 1990• Interdisciplinary applications covering many and growing

number of areas rapidly• Successful formula

• High performance/cost ratio compared with conventional devices• New market/starving market (ink jet printer, communications,

bio-analysis)

• MEMS in next ten years• New materials, designs and fabrication processes (deeper)

• Fully functional smart microsystems

• Continue branching into new areas (wider)

• Biology, chemical engineering, nano-engineering• Accelerated speed to commercialization

01-intro mems history trends

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