© fraunhofer ipms t. zarbock i 05.04.2013 i slide 1 mems clean room 1500 m 2, class 10 150 mm...
TRANSCRIPT
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 1
MEMS CLEAN ROOM
1500 m2, class 10
150 mm (6”) Wafer line
3 shift preparation for R&D and pilot fabrication (24x5)
Access to external services
Technological parameter supervising system
MES / PPS based planning and documentation
ISO 9001 certification
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 2
MEMS Clean Room LayoutAktuelle Clusterung
HIGHTEMPERATURE
LITHOGRAPHY
WET ETCH / CLEANING
DRY ETCH / PVD
BA
CK
EN
D
BA
CK
EN
D
CVD
INLINE METROLOGY
CHARACTERIZATION&
TEST
LAB
CMP
EXTERNALPARTNERS
SEM
LOGISTICS
GOWNING AREA
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 3
MEMS Clean Room: Characterization & Test
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 4
MEMS Clean Room: Lithography
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 5
MEMS Clean Room: Wet Etch / Cleaning
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 6
MEMS Clean Room: Wet Etch / Cleaning
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 7
MEMS Clean Room: Dry Etch / Strip Resist
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 8
MEMS Clean Room: Backend (Bonding, Dispense)
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 9
MEMS Clean Room: Inline Metrology
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 10
MEMS Clean Room: Inline Metrology
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© Fraunhofer IPMST. Zarbock I 05.04.2013 I slide 11
MEMS Clean Room: SEM